Title:
Development of Environmental Friendly Non-Anhydride No-Flow Underfills
Development of Environmental Friendly Non-Anhydride No-Flow Underfills
dc.contributor.author | Wong, C. P. | |
dc.contributor.author | Zhang, Zhuqing | |
dc.contributor.author | Fan, Lianhua | |
dc.date.accessioned | 2006-08-21T12:53:31Z | |
dc.date.available | 2006-08-21T12:53:31Z | |
dc.date.issued | 2002-03 | |
dc.description | ©2002 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or distribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. | en |
dc.description.abstract | Most no-flow underfill materials are based on poxy/anhydride chemistry. Due to the sensitizing nature, the use of anhydride is limited and there is a need for a no-flow underfill using nonanhydride curing system. This paper presents the development of novel no-flow underfill materials based on epoxy/phenolic resin system. Epoxy and phenolic resins of different structures are evaluated in terms of their curing behavior, thermo-mechanical properties, viscosity, adhesion toward passivation, moisture absorption and the reliability in flip-chip underfill package. The influence of chemical structure and the crosslinking density of the resin on the material properties is investigated. The assembly with nonanhydride underfill shows high reliability from the thermal shock test. Solder wetting test has confirmed the sufficient fluxing capability of phenolic resins. Results show that epoxy/phenolic system has great potential for an environmental friendly and highly reliable no-flow underfill. | en |
dc.format.extent | 365209 bytes | |
dc.format.mimetype | application/pdf | |
dc.identifier.citation | IEEE Transactions on Components and Packaging Technologies, Vol. 25, no. 1, March 2002, 140-147 | en |
dc.identifier.uri | http://hdl.handle.net/1853/11426 | |
dc.language.iso | en_US | en |
dc.publisher | Georgia Institute of Technology | en |
dc.publisher.original | Institute of Electrical and Electronics Engineers, Inc., New York | |
dc.subject | Epoxy/phenolic resin | en |
dc.subject | Fluxing capability | en |
dc.subject | Material properties | en |
dc.subject | No-flow underfill | en |
dc.subject | Thermal shock test | en |
dc.title | Development of Environmental Friendly Non-Anhydride No-Flow Underfills | en |
dc.type | Text | |
dc.type.genre | Article | |
dspace.entity.type | Publication | |
local.contributor.author | Wong, C. P. | |
local.contributor.corporatename | School of Materials Science and Engineering | |
local.contributor.corporatename | College of Engineering | |
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relation.isOrgUnitOfPublication | 21b5a45b-0b8a-4b69-a36b-6556f8426a35 | |
relation.isOrgUnitOfPublication | 7c022d60-21d5-497c-b552-95e489a06569 |