Title:
Development of Environmental Friendly Non-Anhydride No-Flow Underfills

dc.contributor.author Wong, C. P.
dc.contributor.author Zhang, Zhuqing
dc.contributor.author Fan, Lianhua
dc.date.accessioned 2006-08-21T12:53:31Z
dc.date.available 2006-08-21T12:53:31Z
dc.date.issued 2002-03
dc.description ©2002 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or distribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. en
dc.description.abstract Most no-flow underfill materials are based on poxy/anhydride chemistry. Due to the sensitizing nature, the use of anhydride is limited and there is a need for a no-flow underfill using nonanhydride curing system. This paper presents the development of novel no-flow underfill materials based on epoxy/phenolic resin system. Epoxy and phenolic resins of different structures are evaluated in terms of their curing behavior, thermo-mechanical properties, viscosity, adhesion toward passivation, moisture absorption and the reliability in flip-chip underfill package. The influence of chemical structure and the crosslinking density of the resin on the material properties is investigated. The assembly with nonanhydride underfill shows high reliability from the thermal shock test. Solder wetting test has confirmed the sufficient fluxing capability of phenolic resins. Results show that epoxy/phenolic system has great potential for an environmental friendly and highly reliable no-flow underfill. en
dc.format.extent 365209 bytes
dc.format.mimetype application/pdf
dc.identifier.citation IEEE Transactions on Components and Packaging Technologies, Vol. 25, no. 1, March 2002, 140-147 en
dc.identifier.uri http://hdl.handle.net/1853/11426
dc.language.iso en_US en
dc.publisher Georgia Institute of Technology en
dc.publisher.original Institute of Electrical and Electronics Engineers, Inc., New York
dc.subject Epoxy/phenolic resin en
dc.subject Fluxing capability en
dc.subject Material properties en
dc.subject No-flow underfill en
dc.subject Thermal shock test en
dc.title Development of Environmental Friendly Non-Anhydride No-Flow Underfills en
dc.type Text
dc.type.genre Article
dspace.entity.type Publication
local.contributor.author Wong, C. P.
local.contributor.corporatename School of Materials Science and Engineering
local.contributor.corporatename College of Engineering
relation.isAuthorOfPublication 76540daf-1e96-4626-9ec1-bc8ed1f88e0a
relation.isOrgUnitOfPublication 21b5a45b-0b8a-4b69-a36b-6556f8426a35
relation.isOrgUnitOfPublication 7c022d60-21d5-497c-b552-95e489a06569
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