Title:
Integrated Passive Devices Fabricated Utilizing Multi-layer, Organic Laminates

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dc.contributor.patentcreator White, George E.
dc.contributor.patentcreator Swaminathan, Madhavan
dc.contributor.patentcreator Sundaram, Venkatesh
dc.contributor.patentcreator Dalmia, Sidharth
dc.date.accessioned 2017-05-12T14:28:13Z
dc.date.available 2017-05-12T14:28:13Z
dc.date.filed 5/27/2005
dc.date.issued 6/27/2006
dc.description.abstract The present invention includes an organic device that can be integrated in a multilayer board made of organic material. The passive devices can be integrally fabricated on a circuit board in either surface mount device (SMD) or ball grid array (BGA) form. Alternatively, the passive device can be constructed in a stand alone SMD or BGA/chip scale package (CSP) form to make it mountable on a multilayer board, ceramic carrier or silicon platform in the form of an integrated passive device. The passive device includes side shielding on two sides in the SMD form and four sides in the BGA/CSP form. The side shielding can be external or in-built.
dc.description.assignee Georgia Tech Research Corporation
dc.identifier.cpc H01F41/041
dc.identifier.cpc H01L21/4857
dc.identifier.cpc H01L25/0652
dc.identifier.patentapplicationnumber 11/140630
dc.identifier.patentnumber 7068124
dc.identifier.uri http://hdl.handle.net/1853/57632
dc.identifier.uspc 333/185
dc.title Integrated Passive Devices Fabricated Utilizing Multi-layer, Organic Laminates
dc.type Text
dc.type.genre Patent
dspace.entity.type Publication
local.contributor.corporatename Georgia Institute of Technology
local.relation.ispartofseries Georgia Tech Patents
relation.isOrgUnitOfPublication cc30e153-7a64-4ae2-9b1d-5436686785e3
relation.isSeriesOfPublication 0f49c79d-4efb-4bd9-b060-5c7f9191b9da
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