Title:
Passive Heat Sink For Dynamic Thermal Management Of Hot Spots

dc.contributor.patentcreator Fedorov, Andrei G.
dc.date.accessioned 2017-05-12T14:26:33Z
dc.date.available 2017-05-12T14:26:33Z
dc.date.filed 5/6/2011
dc.date.issued 2/10/2015
dc.description.abstract A fully-passive, dynamically configurable directed cooling system for a microelectronic device is disclosed. In general, movable pins are suspended within a cooling plenum between an active layer and a second layer of the microelectronic device. In one embodiment, the second layer is another active layer of the microelectronic device. The movable pins are formed of a material that has a surface tension that decreases as temperature increases such that, in response to a temperature gradient on the surface of the active layer, the movable pins move by capillary flow in the directions of decreasing temperature. By moving in the direction of decreasing temperature, the movable pins move away from hot spots on the surface of the active layer, thereby opening a pathway for preferential flow of a coolant through the cooling plenum at a higher flow rate towards the hot spots.
dc.description.assignee Georgia Tech Research Corporation
dc.identifier.cpc H01L23/44
dc.identifier.cpc H01L23/473
dc.identifier.cpc H01L23/3677
dc.identifier.patentapplicationnumber 13/102314
dc.identifier.patentnumber 8953314
dc.identifier.uri http://hdl.handle.net/1853/56957
dc.identifier.uspc 361/689
dc.title Passive Heat Sink For Dynamic Thermal Management Of Hot Spots
dc.type Text
dc.type.genre Patent
dspace.entity.type Publication
local.contributor.corporatename Georgia Institute of Technology
local.relation.ispartofseries Georgia Tech Patents
relation.isOrgUnitOfPublication cc30e153-7a64-4ae2-9b1d-5436686785e3
relation.isSeriesOfPublication 0f49c79d-4efb-4bd9-b060-5c7f9191b9da
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