Title:
DIGITAL CODESIGN OF A POWER MODULE WITH INTEGRATED THERMAL MANAGEMENT
DIGITAL CODESIGN OF A POWER MODULE WITH INTEGRATED THERMAL MANAGEMENT
| dc.contributor.advisor | Graham, Samuel | |
| dc.contributor.author | Kelly, Brian James | |
| dc.contributor.committeeMember | Moreno, Gilbert | |
| dc.contributor.committeeMember | Joshi, Yogendra | |
| dc.contributor.committeeMember | Kumar, Satish | |
| dc.contributor.committeeMember | Shen, Shyh-Chiang | |
| dc.contributor.department | Mechanical Engineering | |
| dc.date.accessioned | 2022-05-18T19:38:18Z | |
| dc.date.available | 2022-05-18T19:38:18Z | |
| dc.date.created | 2022-05 | |
| dc.date.issued | 2022-05-04 | |
| dc.date.submitted | May 2022 | |
| dc.date.updated | 2022-05-18T19:38:19Z | |
| dc.description.abstract | Power electronics are a necessity for many types of electrical energy conversions that are required from electricity sources to load devices. Innovation in these devices is typically driven by the need for higher power density, through either higher power or smaller feature sizes. One of the primary bottlenecks to this advancement is failure mechanisms caused by thermal and thermo-mechanical phenomena which must be addressed through packaging and integrated thermal management. The packaging of these electronics, consist of semiconductor devices mounted onto multilayer substrates that are attached to a convective thermal management solution. Often the effectiveness of a thermal management solution is characterized by both the conductive and convective thermal resistances. Recently, there has been considerable efforts and progress in the development of technologies focused on the reduction of the convective thermal resistances (both single- and two-phase cooling). An opportunity exists for innovation in the reduction of the conductive thermal resistances. This can be done by utilizing a direct cooling design that eliminates the encapsulant and metallized ceramic substrate, this study seeks to investigate such a design. In order to address some of the design changes and understand their impact both conjugate heat transfer and thermo-mechanical models are developed. An optimization scheme is implemented to consider the impacts of various design parameters on the thermohydraulic and thermo-mechanical performance of the system and arrive at a system that has reduced volume with equivalent (or improved) thermohydraulic and thermo-mechanical performance. Finally, a mission-based thermo-mechanical reliability analysis of the optimized designs is proposed, and the trade-offs of the designs are considered. | |
| dc.description.degree | Ph.D. | |
| dc.format.mimetype | application/pdf | |
| dc.identifier.uri | http://hdl.handle.net/1853/66651 | |
| dc.language.iso | en_US | |
| dc.publisher | Georgia Institute of Technology | |
| dc.subject | Optimization | |
| dc.subject | Power Electronics | |
| dc.subject | Electronics Packaging | |
| dc.subject | Electronics Thermal Management | |
| dc.subject | Electronics Reliability | |
| dc.title | DIGITAL CODESIGN OF A POWER MODULE WITH INTEGRATED THERMAL MANAGEMENT | |
| dc.type | Text | |
| dc.type.genre | Dissertation | |
| dspace.entity.type | Publication | |
| local.contributor.advisor | Graham, Samuel | |
| local.contributor.corporatename | George W. Woodruff School of Mechanical Engineering | |
| local.contributor.corporatename | College of Engineering | |
| relation.isAdvisorOfPublication | cf62405d-2133-40a8-b046-bce4a3443381 | |
| relation.isOrgUnitOfPublication | c01ff908-c25f-439b-bf10-a074ed886bb7 | |
| relation.isOrgUnitOfPublication | 7c022d60-21d5-497c-b552-95e489a06569 | |
| thesis.degree.level | Doctoral |