Title:
Interface Mechanisms of Chemical Mechanical Polishing
Interface Mechanisms of Chemical Mechanical Polishing
| dc.contributor.author | Levert, Joe | |
| dc.date.accessioned | 2007-04-11T17:37:52Z | |
| dc.date.available | 2007-04-11T17:37:52Z | |
| dc.date.issued | 1997-10-29 | |
| dc.format.extent | 64582 bytes | |
| dc.format.mimetype | application/pdf | |
| dc.identifier.uri | http://hdl.handle.net/1853/14196 | |
| dc.language.iso | en_US | en |
| dc.publisher | Georgia Institute of Technology | en |
| dc.subject | Sustainability | en |
| dc.subject | Chemical mechanical polishing | en |
| dc.subject | Hydrodynamic polishing | en |
| dc.subject | Static compression | en |
| dc.subject | Suction force | en |
| dc.subject | Wafer displacement | en |
| dc.title | Interface Mechanisms of Chemical Mechanical Polishing | en |
| dc.type | Text | |
| dc.type.genre | Presentation | |
| dspace.entity.type | Publication | |
| local.contributor.corporatename | Georgia Tech Manufacturing Institute | |
| relation.isOrgUnitOfPublication | 8d86298c-7bde-4eb8-b645-95e429e92da3 |