Person:
Wong,
C. P.
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Publication Search Results
Novel Reworkable Fluxing Underfill for Board-Level Assembly
An Improvement of Thermal Conductivity of Underfill Materials for Flip-Chip Packages
A Reworkable Epoxy Resin for Isotropically Conductive Adhesive
Reworkable No-Flow Underfills for Flip Chip Applications
Development of New No-Flow Underfill Materials for Both Eutectic Sn-Pb Solder and a High Temperature Melting Lead-Free Solder