(Georgia Institute of Technology, 2001-09)
Wong, C. P.; Dunne, Rajiv Carl; Sitaraman, Suresh K.; Luo, Shijian; Estes, William E.; Periyasamy, Mookkan; Coburn, John
Multilayered high density interconnect (HDI) processing
on organic substrates typically introduces warpage and
residual stresses. The magnitude of the warpage and the residual
stresses depends on, among other factors, the processing temperatures
and the thermomechanical properties of the dielectric
and substrate materials. In this work, a prospective epoxy-based
dielectric material for such sequentially built up (SBU) high density-
interconnect printed wiring boards (HDI-PWB) is considered.
The polymer is a photo-dielectric dry film (PDDF) material called
ViaLux™ 81, which exhibits a complicated curing behavior due
to the long lifetime of the cationic photoinitiators generated by
ultraviolet (UV) exposure. The objectives of this work are
1) to conduct differential scanning calorimetry (DSC) experiments
and develop a cure kinetics model;
2) to develop a cure shrinkage model based on thermal and
chemical shrinkage experiments;
3) to determine the thermomechanical properties of partially
and fully cured Vialux™ 81 dry film.
All of these experimental characterizations are necessary to select
suitable process parameters and to obtain a consistent product
with the desired physical and mechanical properties.