(Georgia Institute of Technology, 1999-02)
Wong, C. P.; Bollampally, Raja Sheker
Thermal management plays a very vital role in the
packaging of high performance electronic devices. Effective heat
dissipation is crucial to enhance the performance and reliability
of the packaged devices. Liquid encapsulants used for glob top,
potting, and underfilling applications can strongly influence the
package heat dissipation. Unlike molding compounds, the filler
loading in these encapsulants is restrained. This paper deals with
the development and characterization of thermally conductive
encapsulants with relatively low filler loading. A comparative
study on the effect of different ceramic fillers on the thermal
conductivity and other critical properties of an epoxy based liquid
encapsulant is presented.