Title:
Enhanced thermal conductivity of liquid encapsulants for electronic packaging
Enhanced thermal conductivity of liquid encapsulants for electronic packaging
Author(s)
Bollampally, Raja Sheker
Advisor(s)
Wong, C. P.
Editor(s)
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Abstract
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Date Issued
1998-12
Extent
Resource Type
Text
Resource Subtype
Thesis
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Access restricted to authorized Georgia Tech users only.