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School of Materials Science and Engineering

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Comparative Study of Thermally Conductive Fillers for Use in Liquid Encapsulants for Electronic Packaging

1999-02 , Wong, C. P. , Bollampally, Raja Sheker

Thermal management plays a very vital role in the packaging of high performance electronic devices. Effective heat dissipation is crucial to enhance the performance and reliability of the packaged devices. Liquid encapsulants used for glob top, potting, and underfilling applications can strongly influence the package heat dissipation. Unlike molding compounds, the filler loading in these encapsulants is restrained. This paper deals with the development and characterization of thermally conductive encapsulants with relatively low filler loading. A comparative study on the effect of different ceramic fillers on the thermal conductivity and other critical properties of an epoxy based liquid encapsulant is presented.

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Enhanced thermal conductivity of liquid encapsulants for electronic packaging

1998-12 , Bollampally, Raja Sheker