Organizational Unit:
School of Materials Science and Engineering
Permanent Link
Research Organization Registry ID
Description
Previous Names
Parent Organization
Parent Organization
Includes Organization(s)
ArchiveSpace Name Record
Publication Search Results
Modeling, design and fabrication of substrate-embedded inductors with high inductance density and low DC resistance for integrated voltage regulators
Polymer materials, processes, and structures for optical turning in 3D glass photonic interposers
High-density capacitor array fabrication on silicon substrates
Thermo-mechanical reliability of ultra-thin low-loss system-on-package substrates
Modeling, design and demonstration of large 2.5D glass BGA packages for balanced chip-and-board-level reliability
Fine-pitch Cu-snag die-to-die and die-to-interposer interconnections using advanced slid bonding
Chip-last embedded low temperature interconnections with chip-first dimensions
Modeling, design, fabrication and reliability characterization of ultra-thin glass BGA package-to-board interconnections
Thin-film trench capacitors for silicon and organic packages
High density and high reliability thin film embedded capacitors on organic and silicon substrates