Person:
Kim,
Hyesoon
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A New Temperature Distribution Measurement Method on GPU Architectures Using Thermocouples
Person:
Kim,
Hyesoon
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In recent years, the many-core architecture has seen a rapid increase in the number of on-chip cores with a much slower increase in die
area. This has led to very high power densities in the chip. Hence, in addition to power, temperature has become a first-order design constraint
for high-performance architectures. However, measuring temperature is very limited to on-chip temperature sensors, which might
not always be available to researchers. In this paper, we propose a new temperature-measurement system using thermocouples for many-core GPU architectures and devise a
new method to control GPU scheduling. This system gives us a temperature distribution heatmap of the chip. In addition to monitoring
temperature distribution, our system also does run-time power consumption monitoring. The results show that there is a strong corelation
between the on-chip heatmap patterns and power consumption. Furthermore, we provide actual experimental results that show
the relationship between TPC utilizations and their active locations that reduce temperature and power consumption.