Person:
Kohl, Paul A.

Permanent Link
https://hdl.handle.net/1853/71414
Associated Organization(s)
ORCID
ArchiveSpace Name Record

Filters

2008 - 2009 1 2010 - 2016 1
2
2 1
2 1
2
2
Reset filters

Settings
search.filters.applied.f.isOrgUnitOfPublicationTitle: Institute for Electronics and Nanotechnology (IEN) ×

Publication Search Results

Now showing 1 - 2 of 2
No Thumbnail Available
Item

Transient Polymers for Low-k Dielectrics and Decomposing Electronic Devices

2016-09-16 , Kohl, Paul A.

Dielectric materials (i.e. insulators) provide critical functions throughout the packaging hierarchy, including on-chip dielectrics, package substrates, and printed wiring boards. Transient polymers, those which vaporize on command, can be used to form ultra low-k dielectrics, such as porous materials or air-cavities. Transient polymers can also be used as coatings or structural materials in electronic packages and devices enabling the disappearance of the device when the collection, recovery or disposal of the device is difficult. In this presentation, the nature of transient polymers will be described including their synthesis, and physical properties. Transient polymers can be decomposed to the liquid or gaseous state when exposed to thermal, chemical or photo-chemical stimulus. The response time and type of stimulus will be described. Finally, several applications for transient polymers in the fabrication of unique devices, structures or packages will be described.

View
Thumbnail Image
Item

High-Performance Chip-to-Chip Communications Using Advanced Materials and Structures

2008-09-09 , Kohl, Paul A. , Spencer, Todd , Osborn, Tyler

The "off-chip" bandwidth is a major bottleneck causing system delays and limited throughput, especially in areas such as processor-to-memory bandwidth and processor-to-network. The ITRS cites off-chip signal bandwidth exceeding 60 GHz within 10 years. Organic substrates (i.e. chip packages or interposers) with flip-chip solder connections are the core of the first and second level of interconnect. Off-chip bandwidth is limited to several GHz due to frequency dependent attenuation, signal reflections, and crosstalk within the polymer dielectric, via structures, and I/O signal path transitions within the chip substrate and mother board. In this work, we have introduced advances in off-chip interconnect using air-isolated, coaxial links on substrates and boards to demonstrate ultra high-speed chip-to-chip and chip-to-network communications. New approaches have been found to fabricating high frequency I/O, air-and isolated coaxial links on the substrate. The materials, processes and electrical characteristics will be presented.

View