Person:
Kohl,
Paul A.
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Publication Search Results
Polylithic integration of electrical and optical interconnect technologies for gigascale fiber-to-the-chip communication
Chip-to-Module Interconnections Using "Sea of Leads" Technology
High-Performance Chip-to-Chip Communications Using Advanced Materials and Structures
Next-generation microvia and global wiring technologies for SOP
Rapid curing of positive tone photosensitive polybenzoxazole based dielectric resin by variable frequency microwave processing
Fabrication of microchannels using polynorbornene photosensitive sacrificial materials