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Kohl, Paul A.

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Author: Bidstrup-Allen, Sue Ann ×

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    Rapid curing of positive tone photosensitive polybenzoxazole based dielectric resin by variable frequency microwave processing
    (Georgia Institute of Technology, 2006-06) Tanikella, Ravindra V. ; Sung, Taehyun ; Bidstrup-Allen, Sue Ann ; Kohl, Paul A.
    High performance polymer dielectrics such as polyimides and polybenzoxazoles are used for several applications in the semiconductor industry due to their excellent dielectric and thermomechanical properties. However, these materials require curing at high temperatures for long periods of time in order to achieve the desired properties. High temperature exposure for long periods of time can be detrimental to device characteristics and reliability. In this study, rapid low temperature curing of a positive tone photosensitive polybenzoxazole based dielectric resin by variable frequency microwave (VFM) processing was investigated. The chemical changes occurring in the film during the condensation reaction and the percent conversion achieved as a function of cure condition were monitored by Fourier transform infrared spectroscopy. The effectiveness of rapid VFM curing was studied by characterizing the optical, electrical, and thermomechanical properties of VFM cured films with thermally cured films. The thermal stability of cured films was investigated by thermal gravitational analysis (TGA) and mass spectrometry (MS) studies. The results showed that a higher percent conversion and higher thermal stability can be achieved by using VFM processing than can be obtained using conventional thermal curing at the same cure temperature. However, the complete removal of photopackage related residual products requires slow ramp rates and long cure times.
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    Next-generation microvia and global wiring technologies for SOP
    (Georgia Institute of Technology, 2004-05) Sundaram, Venky ; Tummala, Rao R. ; Liu, Fuhan ; Kohl, Paul A. ; Li, Jun ; Bidstrup-Allen, Sue Ann ; Fukuoka, Yoshitaka
    As microsystems continue to move toward higher speed and microminiaturization, the demand for interconnection density both on the IC and the package levels increases tremendously. The 2002 ITRS roadmap update identifies the need for sub-100-µm area array pitch and data rates of 10 Gb/s in the package or board by the year 2010, requiring much finer lines and vias than the current microvias of 50 µm diameter and lines and spaces of 25 µm. After a brief description of the future need for high-density substrates, the historical evolution of microvia technologies worldwide is summarized. With the move toward highly integrated and higher performance system-on-a-package (SOP) technology, the demand for microvia wiring density in the package is increasing dramatically requiring new innovations in fine line, ultralow-loss, and ultrathin-film dielectrics. The low-cost needs of this technology are driving research in high throughput and large area processes in dielectric and conductor deposition. The third section of this paper describes in detail some of the key emerging global microvia research and development in the fabrication of microminiaturized, multifunction SOP packages including rapid curing of low-loss dielectric thin films on organic substrates, environmentally friendly high-speed electroless copper plating, ultrafine lines, and spaces down to 5 µm and low-cost stacked via structures without chemical-mechanical polishing. This paper concludes with a perspective on future directions in dielectrics and conductor materials and processes leading to ultrahigh-density and low-cost microvia technologies for build-up SOP implementation.
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    High Temperature Superconductor multichip modules
    (Georgia Institute of Technology, 1991) Kohl, Paul A. ; Bidstrup-Allen, Sue Ann