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School of Chemical and Biomolecular Engineering

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College of Engineering

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Now showing 1 - 10 of 19

Electrode Modifications for Improved Anion Exchange Membrane Water Electrolyzer Durability

(Georgia Institute of Technology, 2021-12-14) Dobbs, Alexandra

Within this dissertation electrode modifications for improved anion exchange membrane (AEM) electrolyzer durability are investigated. Ionic and inert catalyst binders were analyzed during electrolysis and the relationships between material properties and electrode stabilization or degradation are discussed. Systematic analysis of electrode formulations illuminates different catalyst deactivation mechanisms and potential solutions.
Hybrid direct methanol fuel cells

(Georgia Institute of Technology, 2012-05-21) Joseph, Krishna Sathyamurthy

A new type of fuel cell that combines the advantages of a proton exchange membrane fuel cells and anion exchange membrane fuel cells operated with methanol is demonstrated. Two configurations: one with a high pH anode and low pH cathode (anode hybrid fuel cell (AHFC)),and another with a high pH cathode and a low pH anode (cathode hybrid fuel cell (CHFC)) have been studied in this work. The principle of operation of the hybrid fuel cells were explained. The two different hybrid cell configurations were used in order to study the effect of the electrode fabrication on fuel cell performance. Further, the ionomer content and properties such as the ion exchange capacity and molecular weight were optimized for the best performance. A comparison of the different ionomers with similar properties is carried out in order to obtain the best possible ionomer for the fuel cell. An initial voltage drop was observed at low current density in the AHFC, this was attributed to the alkaline anode and the effect of the ionomers with the new cationic groups were studied on this voltage drop was studied. These ionomers with the different cationic groups were studied in the CHFC design as well. Finally, the use of non platinum catalyst cathode with the CHFC design was also demonstrated for the first time.
All-copper chip-to-substrate interconnections for flip-chip packages

(Georgia Institute of Technology, 2010-07-09) Lightsey, Charles Hunter

Avatrel 8000P's excellent photo-definition properties and mechanical strength make it an ideal polymer collar material. Avatrel 8000P is a high contrast, I-line sensitive mixture that can be developed in traditional aqueous-base developers. The great photolithographical performance of this photopolymer can be partly contributed to the minimal amount of light absorbed by the base norbornene polymer. The processing conditions noted in this work are an optimized version, which have been shown to give superior photolithographical performance. The simple baking procedures make Avatrel 8000P easier to process than SU-8. The ability to develop Avatrel 8000P in aqueous base can reduce chemical waste. As shown by SEM images, high fidelity structures with aspect ratios of 7:1 can be fabricated in thick films with vertical sidewalls. Bonding between two copper surfaces over various gap sizes was achieved by electroless deposition without the addition of surfactants or inhibitors in the bath. The effect of anneal temperature on the electroless bond formed was analyzed. The electroless bond strength increased with anneal temperature. However, the bond strength estimation for samples annealed at 80°C to 120°C is a minimum value due to the failure location of most of the pillars and the resulting area used in the calculation of bond strength. Grain growth from copper recrystallization and removal of small defects improve the bond strength. Large voids at the interface of the two pillars were related to rough starting surfaces for the electroplated pillars.
Electrochemical comparison and deposition of lithium and potassium from phosphonium- and ammonium-tfsi ionic liquids

(Georgia Institute of Technology, 2009-04-09) Vega, Jose A.

In this work, ionic liquids (ILs) were investigated for use as battery electrolytes. The ILs were synthesized from quaternary ammonium and phosphonium salts and TFSI-. A dendrite free lithium metal anode was demonstrated by deposition of a lithium-potassium alloy. Several phosphonium ILs were synthesized using the TFSI- and PF6- anions until a room temperature IL was obtained. The smaller size, highly symmetric PF6- anion yielded high melting point salts, while TFSI- yielded much lower melting point ILs. When a room temperature IL, Bu3HexP+TFSI-, was obtained the analogous ammonium IL, Bu3HexP+TFSI-, was synthesized and compared. The phosphonium-based ionic liquid showed improved stability and physical properties compared to the analogous ammonium-based IL. The phosphonium-based IL had higher conductivity, 0.43 mS/cm, than the ammonium-based IL, 0.28 mS/cm. The addition of LiTFSI to both ILs led to a decrease in conductivity and increase in viscosity. The lower viscosity and higher stability of the phosphonium-based IL led to higher current density and stability for electrodeposited lithium metal. IL reduction interfered with lithium deposition reflecting lower coulombic efficiencies and giving the appearance of an unstable lithium couple. An optimum deposition potential was found which was bounded by the electrochemical stability of each IL. The stability of lithium in the ILs increased at lower temperature due to slower reactivity with the IL. Addition of higher quantities of lithium ions caused a higher fraction of the cathodic current going to lithium deposition that was reoxidized. The stability of lithium in the ILs increased at lower temperature due to slower reactivity with the IL. The electrodeposition and reoxidation of potassium was also demonstrated. Deposition of a lithium-potassium alloy caused slight increases in the cathodic and anodic currents along with higher coulombic efficiencies. Also, it was found that a lithium-potassium alloy could be deposited at high current for long times without the occurrence of dendrites.
The Fabrication of Direct-Write Waveguides via the Glassy-State Processing of Porous Films: UV-Induced Porosity and Solvent-Induced Porosity

(Georgia Institute of Technology, 2007-05-03) Abdallah, Jassem

The incorporation of porosity in a material potentially results in the changes in electrical, mechanical and electrical properties and has generated much interest by researchers. The development of new techniques for inducing porosity in thin films may prove advantageous if they lead to a decrease in processing complexity, or an increase in the processing flexibility by widening the window of compatible physical conditions, or the improvement of the final properties of the porous materials. Two processing techniques were developed to produce porosity in thin dielectric films at temperatures below the glass transition temperature of the host matrix. These glassy-regime processing methods relied on the susceptibility of hydrogen silsesquioxane (HSQ) to gelation in the glassy regime when exposed to polar substances. Both of these glassy-regime processing methods relied on the susceptibility of hydrogen silsesquioxane (HSQ) towards gelation in the glassy regime when exposed to polar substances. The first processing method made use of co-solvent mixtures of polar non-protic organic solvent to serve both as gelation catalysts and pore-generators. HSQ films were soaked in the polar organic co-solvents, which penetrated the films and initiated crosslinking throughout the matrix. Afterwards the films were baked, volatilizing entrapped solvents and producing air pockets within the rigid matrix. The second porosity method used UV-radiation to initiate acid-catalyzed decomposition of polycarbonate sacrificial polymers after first using bases to catalyze the gelation of HSQ. The radiation-based (direct-write) decomposition of the porogen enabled the selective patterning of regions porosity via the use of a photomask, which resulted in the creation of refractive index profiles in the direct-written films. Porous films that were produced by these two glassy-state processing techniques were used to build slab waveguide structures. Optical characterization experiments showed that the fabricated waveguides had average propagation losses of 16 - 27 dB/cm for the first guided TE mode and about 36-40 dB/cm, for the second TE guided mode. It is believed that the large propagation loss values were caused by a combination of the Rayleigh scattering from the relatively large UV-induced pores produced in the direct-write layers as well as scattering induced by surface roughness.
Electrochemical Splitting of Sodium Sulfate

(Georgia Institute of Technology, 2006-05-22) Davis, Samuel M.

Five cation exchange membranes and four anion exchange membranes were tested in a three-compartment, two-membrane, electrolysis salt-splitting cell for the recycle of sodium sulfate into sodium hydroxide and sulfuric acid. The cell is further examined using DuPont Nafion 324 cation exchange membrane and Sybron Ionac MA-7500 anion exchange membrane to determine the maximum concentration of sodium hydroxide that can be produced by electrolysis salt-splitting as well as to determine the chief source of inefficiency. The discussion includes recommendations for future electrolysis salt-splitting cells and a mathematical model of the cell is created to determine optimum operating conditions.
Photoacid Generators for Catalytic Decomposition of Polycarbonate

(Georgia Institute of Technology, 2006-01-13) Cupta, Mark Glenn

It is the goal of this body of work to research an assortment of different photoacid generators (PAGs) and quantify their ability to perform the decomposition of poly(propylene carbonate) (PPC). Adding PAGs to PPC allows for a decreased polymer decomposition temperature, which can in turn be used as a sacrificial polymer for the fabrication of various microelectromechanical and microfluidic devices. A focus will be placed on relating the properties of the PAG such as acid strength, acid volatility, and PAG activation to processing issues like percentage of total film decomposition, amount and composition of film residue, decomposition rate, decomposition temperature, and environmental dependencies. This research discovered that the use of superacid triflic and nonaflic based PAGs were not adequate for the decomposition of PPC due to the high vapor pressure of the acid. Furthermore, the non-fluorinated sulfonic acid based PAGs do not posses the super-acid level acidity needed to sufficiently decompose PPC. Conversely, a perfluorinated methide and a tetrakis(pentafluoropheyl)borate based PAG both demonstrated the capability for high level PPC decomposition. Building on the knowledge gained through experimentation with these individual PAGs, the creation of a novel Combination PAG was accomplished. The Combination PAG uses acid groups with different physical properties collectively working to achieve what neither could complete individually.
Air-Gaps via Thermally Decomposable Polymers and Their Application to Compliant Wafer Level Packaging (CWLP)

(Georgia Institute of Technology, 2005-01-27) Kelleher, Hollie Anne

A method was proposed for the fabrication of air-gaps embedded in dielectric layers using thermally decomposable sacrificial polymers. The research had two main objectives: (1) the development and characterization of air-gap fabrication for use in a wide spectrum of applications; and (2) the integration of air-gaps into a specific application: air-gaps in an integrated circuit compliant wafer level packaging technology, Sea of Leads. Polynorbornene and polycarbonate sacrificial materials were used to form air-gaps at temperatures of 200, 300, and 400oC. Fabrication results of air-gaps encapsulated by both inorganic and organic dielectric materials indicated that the thermal and mechanical properties of the dielectric materials at the decomposition temperature of the sacrificial material resulted in success or failure of the process. Multi-layered encapsulating materials enabled the use of a dielectric material which does not successfully form air-gaps on its own. Thermal decomposition of the sacrificial materials with alteration in the polymer chemistry was studied. Polynorbornene containing 90 mol% butyl and 10 mol% triethoxysilyl side groups was selected as an optimum 400oC decomposition temperature material. The decomposition of this polynobornene composition in an open nitrogen atmosphere was contrasted to decomposition of the polynorbornene while completely encapsulated in a dielectric material. Thermogravimetric analysis and examination of residual surfaces following the decomposition, combined with comparison of the overall kinetic parameters of the decomposition reaction, indicated differences in the two overall processes. The design concept of Sea of Leads three-dimensionally compliant packaging technology with embedded air-gaps is presented. The critical issues resulting from the addition of air-gaps into the process are the compatibility of materials, lithography on topographical features, and yield and uniformity. Factors influencing the z-axis mechanical performance of the air-gap were determined to be the air-gap shape and size, the encapsulating material dielectric properties and thickness, and the decomposition conditions. Model calculations combined with the known limitations of fabrication provided a design space for maximum out-of-plane mechanical movement and compliance of the air-gaps. The results demonstrated that the incorporation of an embedded air-gap in Sea of Leads technology can achieve the necessary z-axis compliance goals for future applications.
Design, Modeling, and Testing of High Performance RF Bistable Magnetic Actuators

(Georgia Institute of Technology, 2005-01-12) Gray, Gary Dean, Jr.

Due to the limitations of electrostatic RF actuators, magnetic actuation was investigated, and the optimal design space for a bistable magnetic actuator with ultra-low actuation energy and large actuation distance (100 m) has been modeled. Attention was paid to minimizing the energy expended to minimize heat dissipation and power consumption so that the device could be used over a wide temperature range, including cryogenic environments. A more desirable switching regime existing for low magnetic fields (10 mT) was found that requires shorter pulses (s vs ms) and lower actuation energy (less than 5 J vs 100 J) than designs outside of this space. The device was modeled to latch in two states, based on the interaction of the magnetic actuator with an external magnetic field. Based on this model, a bistable magnetic MEMS actuator was fabricated using microelectronic processes including a two-substrate flip-chip assembly, multilevel metallization, and sublimation release to avoid stiction. The actuator was found to have excellent correspondence between observed and modeled behavior. The benefits of shape anisotropy are quantified. Lithographic patterning of the magnetic material into long narrow strips along the actuators length resulted in much greater magnetic torques being developed at reduced external field levels. Low levels of anisotropy led to designs with low levels of magnetization and therefore required higher external magnetic fields, whereas high levels of anisotropy led to designs latching at 10 mT levels with contact forces greater than 5 N with switching energies less than 100 J and a switching speed of less than 5 ms. More moderate levels of anisotropy resulted in a design space where less than 1 J switching energies could be realized. Electrical performance has been demonstrated over 2 million cycles, and mechanical performance to 150 million cycles. Applications include electronics, microfluidics, and cryogenic devices.
Variable Frequency Microwave Reflow of Lead-Free Solder Paste

(Georgia Institute of Technology, 2004-06-29) Reid, Pamela Patrice

As the world moves towards eliminating lead from consumer products, the microelectronics industry has put effort into developing lead-free solder paste. The major drawback of lead-free solder is the problems caused by its high reflow temperature. Variable frequency microwave (VFM) processing has been shown to allow some materials to be processed at lower temperatures. Issues addressed in this study include using VFM to reduce the solder reflow temperature, comparing the heating rate of different size solder particles, and comparing the reliability of VFM reflowed solder versus conventionally reflowed solder. Results comparing the effect of particle size on the heating rate of solder showed that the differences were negligible. This is due in part to the particle sizes overlapping. Many lead-free solder pastes reflow around 250℃. Results indicate that when using the VFM, lead-free solder paste will reflow at 220℃. The reliability of solder that was reflowed using the VFM at the reduced temperature was found to be comparable to solder reflowed in a conventional manner. Based on these findings, VFM processing can eliminate the major obstacles to making lead-free solder paste a more attractive option for use in the microelectronics industry.