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ItemMaterial characterization of high dielectric constant polymer–ceramic composite for embedded capacitor to RF application(Georgia Institute of Technology, 2002) Rao, Yang ; Yue, Jireh ; Wong, C. P.Embedded capacitor technology can improve electrical performance and reduce assembly cost compared with traditional discrete capacitor technology. Polymer–ceramic composites have been of great interest as embedded capacitor material because they combine the processability of polymers with the desired electrical properties of ceramics. A novel nano-structure polymer–ceramic composite with very high dielectric constant (εr ∼150 , a new record for the highest reported εr value of nano-composite) has been developed in our previous work. RF application of embedded capacitors requires that insulating material have high dielectric constant at high frequency (GHz), low leakage current, high breakdown voltage and high reliability. A set of electrical tests have been conducted in this work to characterize the properties of the in house developed novel high dielectric constant polymer–ceramic nano-composite. Results show that this material has fairly high dielectric constant in the RF range, low electrical leakage and high breakdown voltage. 85/85 TH aging test has been performed and it had shown this novel high K material has good reliability. An embedded capacitor prototype with capacitance density of 35 nF/cm² has been manufactured using this nano-composite with spinning coating technology. This novel nano-composite can be used for the integral capacitors in the RF applications.
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ItemHigh dielectric constant materials development and electrical simulation of embedded capacitors(Georgia Institute of Technology, 2001-05) Rao, Yang
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ItemAn Improved Methodology for Determining Temperature Dependent Moduli of Underfill Encapsulants(Georgia Institute of Technology, 2000-09) Wong, C. P. ; Rao, Yang ; Shi, SonghuaFinite element analyses (FEAs) have been widely used to preventively predict the reliability issues of flip-chip (FC) packages. The validity of the simulation results strongly depends on the inputs of the involved material properties. For FC packages Young’s modulus-temperature relationship is a critical material property in predicting of the package reliability during 55°C to 125°C thermal cycling. Traditional tensile tests can obtain the modulus at selected temperatures, but it is tedious, expensive, and unable to accurately predict the Young’s modulus-temperature relationship within a wide temperature range. Thus, this paper is targeted to provide a simple but relatively accurate methodology to obtain the Young’s modulus-temperature relationship. In this paper, three commercial silica filled underfill materials were studied. A simple specimen (based on ASTM D638M) preparation method was established using a Teflon mold. A dynamic-mechanical analyzer (DMA) was used to obtain the stress-strain relationship under controlled force mode, storage and loss modulus under multi-frequency mode, and stress relaxation under stress relaxation mode. A simple viscoelastic model was used and an empirical methodology for obtaining Young’s modulus-temperature relationship was established.
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ItemModeling of imbedded passive components(Georgia Institute of Technology, 1999) Wong, C. P. ; Rao, Yang ; Qu, Jianmin
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ItemMechanical behavior characterization of some new materials for high density interconnect substrates(Georgia Institute of Technology, 1998-12) Rao, Yang
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ItemModeling of embedded passive components(Georgia Institute of Technology, 1998) Wong, C. P. ; Rao, Yang ; Qu, Jianmin ; Troutman, Tia Shawana