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School of Materials Science and Engineering
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Epoxy/triazine based high performance molding compound for next generation power electronics packaging
Highly conductive stretchable electrically conductive composites for electronic and radio frequency devices
Encapsulation and design of scalable packaging materials for thin film perovskite solar cell applications
Increase the packing density of vertically aligned carbon nanotube array for the application of thermal interface materials
Study on epoxy based composites for high temperature molding compounds