Organizational Unit:
School of Materials Science and Engineering
Permanent Link
Research Organization Registry ID
Description
Previous Names
Parent Organization
Parent Organization
Includes Organization(s)
ArchiveSpace Name Record
Publication Search Results
High Thermal Conductivity Epoxy Composites In The Application Of 3D Semiconductor Packaging
Encapsulation and design of scalable packaging materials for thin film perovskite solar cell applications
Uniform high-aspect-ratio 3D micro-and nanomanufacturing on silicon by (electro)-metal-assisted chemical etching: fundamentals and applications
A thin film triode type carbon nanotube field electron emission cathode
Transition Metal Complexes As Latent Catalyst And Adhesion Promoter In Epoxy Resin
Study on epoxy based composites for high temperature molding compounds
Metal-reduced graphene oxide for supercapacitors and alternating current line-filters
Epoxy/triazine based high performance molding compound for next generation power electronics packaging
Functional polymer composite encapsulants for electronic packaging
Rational design of electrically conductive polymer composites for electronic packaging