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School of Materials Science and Engineering
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Publication Search Results
Design and Demonstration of Mechanical and Electrical Reliability of 1-micron Redistribution Layers
Sintered nanoporous copper die-attach interconnections: Syntheis and characterization
Modeling, design, materials, processes and reliability of multi-layer redistribution wiring layers on glass substrates for next generation of high-performance computing applications
Ultra-thin polymer dielectric materials and ultra-small via and trench processes for 20micron bump pitch re-distribution layer (RDL) structures for high density packages
Modeling, Design and Demonstration of a Single, Innovative Metallurgical System for Socketable and Surface-Mountable Board-Level Interconnections
ULTRA-LOW DIELECTRIC CONSTANT AND ULTRA-THIN POLYMER DIELECTRIC MATERIALS, PROCESSES AND RELIABILITY FOR ULTRA-HIGH BANDWIDTH COMPUTING APPLICATIONS
Modeling, design, fabrication and characterization of miniaturized, high-current handling and high-efficiency inductors
Modeling, Design and Demonstration of 1 µm Wide Low Resistance Panel Redistribution Layer Technology for High Performance Computing Applications
Advanced materials and processes for high-density capacitors for next-generation integrated voltage regulators
Reliable fine-pitch chip-to-substrate copper interconnections with high-through assembly and high power-handling
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