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School of Materials Science and Engineering
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Publication Search Results
Advanced materials and processes for high-density capacitors for next-generation integrated voltage regulators
Reliable fine-pitch chip-to-substrate copper interconnections with high-through assembly and high power-handling
Modeling, design and demonstration of ultra-short, fine-pitch solder-based interconnection systems with high-throughput assembly
Nanoscale electrode and dielectric materials, processes and interfaces to form thin-film tantalum capacitors for high-frequency applications
Modeling, design, materials, processes and reliability of multi-layer redistribution wiring layers on glass substrates for next generation of high-performance computing applications
Ultra-thin polymer dielectric materials and ultra-small via and trench processes for 20micron bump pitch re-distribution layer (RDL) structures for high density packages
Modeling, design, fabrication and reliability characterization of ultra-thin glass BGA package-to-board interconnections
Modeling, design, fabrication and characterization of miniaturized, high-current handling and high-efficiency inductors
Modeling, design and demonstration of large 2.5D glass BGA packages for balanced chip-and-board-level reliability
Polymer materials, processes, and structures for optical turning in 3D glass photonic interposers