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School of Materials Science and Engineering
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Advances in electronic packaging technologies by ultra-small microvias, super-fine interconnections and low loss polymer dielectrics
Thermo-mechanical reliability of ultra-thin low-loss system-on-package substrates
Characterization of Nanostructured Metals and Metal Nanowires for Ultra-High Density Chip-to-Package Interconnections
New Carbon-Silicon Carbide Composite Board Material for High Density and High Reliability Packaging
Fatigue modeling of nano-structured chip-to-package interconnections
Ultra thin ultrafine-pitch chip-package interconnections for embedded chip last approach
Chip-Package Nano-Structured Copper and Nickel Interconnections with Metallic and Polymeric Bonding Interfaces
High density and high reliability thin film embedded capacitors on organic and silicon substrates
Copper to copper bonding by nano interfaces for fine pitch interconnections and thermal applications
Ultra-thin Ceramic Films for Low-temperature Temperature Embedding of Decoupling Capacitors into Organic Printed Wiring Boards