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School of Materials Science and Engineering
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Publication Search Results
High density and high reliability thin film embedded capacitors on organic and silicon substrates
Copper to copper bonding by nano interfaces for fine pitch interconnections and thermal applications
Thermo-mechanical reliability of ultra-thin low-loss system-on-package substrates
New Carbon-Silicon Carbide Composite Board Material for High Density and High Reliability Packaging
Ultra thin ultrafine-pitch chip-package interconnections for embedded chip last approach
Effect of intermetallic compounds on thermomechanical reliability of lead-free solder interconnects for flip-chips