Organizational Unit:
School of Materials Science and Engineering

Permanent Link
https://hdl.handle.net/1853/70762
Research Organization Registry ID
Description
Previous Names
Parent Organization
Parent Organization
Organizational Unit
Includes Organization(s)
ArchiveSpace Name Record
https://finding-aids.library.gatech.edu/agents/corporate_entities/1126

Filters

1990 - 1999 8 2000 - 2009 7
15
15
Reset filters

Settings
search.filters.applied.f.advisor: Saxena, Ashok × Type: Text × search.filters.applied.f.resourcesubtype: Dissertation ×

Publication Search Results

Now showing 1 - 10 of 15
Thumbnail Image
Item

Fatigue modeling of nano-structured chip-to-package interconnections

2009-01-09 , Koh, Sau W.

Driven by the need for increase in system¡¯s functionality and decrease in the feature size, International Technology Roadmap for Semi-conductors has predicted that integrated chip packages will have interconnections with I/O pitch of 90 nm by the year 2018. Lead-based solder materials that have been used for many decades will not be able to satisfy the thermal mechanical requirements of these fines pitch packages. Of all the known interconnect technologies, nanostructured copper interconnects are the most promising for meeting the high performance requirements of next generation devices. However, there is a need to understand their material properties, deformation mechanisms and microstructural stability. The goal of this research is to study the mechanical strength and fatigue behavior of nanocrystalline copper using atomistic simulations and to evaluate their performance as nanostructured interconnect materials. The results from the crack growth analysis indicate that nanocrystalline copper is a suitable candidate for ultra-fine pitch interconnects applications. This study has also predicts that crack growth is a relatively small portion of the total fatigue life of interconnects under LCF conditions. The simulations result conducted on the single crystal copper nano-rods show that its main deformation mechanism is the nucleation of dislocations. In the case of nanocrystalline copper, material properties such as elastic modulus and yield strength have been found to be dependent on the grain size. Furthermore, it has been shown that there is competition between the dislocation activity and grain boundary sliding as the main deformation mode This research has shown that stress induced grain coarsening is the main reason for loss of mechanical performance of nanocrystalline copper during cyclic loading. Further, the simulation results have also shown that grain growth during fatigue loading is assisted by the dislocation activity and grain boundary migration. A fatigue model for nanostructured interconnects has been developed in this research using the above observations Lastly, simulations results have shown that addition of the antimony into nanocrystalline copper will not only increase the microstructure stability, it will also increase its strength.

View
Thumbnail Image
Item

Predicting the Hall-Petch Effect in FCC Metals Using Non-Local Crystal Plasticity

2006-11-30 , Counts, William A.

It is well documented that the mechanical response of polycrystalline metals depends on the metal's microstructure, for example the dependence of yield strength on grain size (Hall-Petch effect). Local continuum approaches do not address the sensitivity of deformation to microstructural features, and are therefore unable to capture much of the experimentally observed behavior of polycrystal deformation. In this work, a crystal plasticity model is developed that predicts a dependence of yield strength on grain size without grain size explicitly entering into the constitutive equations. The grain size dependence in the model is the result of non-local effects of geometrically necessary dislocations (GNDs), i.e. GNDs harden both the material at a point and the surrounding material. The conventional FeFp kinematics for single crystals have been augmented based on a geometric argument that accounts for the grain orientations in a polycrystal. The augmented kinematics allows an initial GND state at grain boundaries and an evolving GND state due to sub-grain formation within the grain to be determined in a consistent manner. Numerically, these non-local affects are captured using a non-local integral approach rather than a conventional gradient approach. The non-local crystal plasticity model is used to simulate the tensile behavior in copper polycrystals with grain sizes ranging from 14 to 244 micron. The simulation results show a grain size dependence on the polycrystal's yield strength, which are qualitatively in good agreement with the experimental data. However, the Hall-Petch exponent predicted by the simulations is more like d-1 rather than d-0.5. The effects of different simulation parameters including grain shape and misorientation distribution did not greatly affect the Hall-Petch exponent. The simulation results indicate that the Hall-Petch exponent is sensitive to the grain boundary strength: the Hall-Petch exponent decreases as grain boundary strength decreases. The intragrain misorientations predicted by the non-local model were compared with experiments on polycrystalline nickel. Experimentally, the intragrain misorientations were tracked by electron back scatter diffraction (EBSD) at various strain levels from the same location. On average, the simulation results predicted enough misorientation throughout the sample. However, the model did not correctly predict the spatial details of the intragrain misorientation.

View
Thumbnail Image
Item

Use of atomic force microscopy for characterizing damage evolution during fatigue

2000-08 , Cretegny, Laurent

View
Thumbnail Image
Item

Oxidation and mechanical damage in unidirectional SiC/Si#N# composite at elevated temperatures

1996-05 , Yang, Fan

View
Thumbnail Image
Item

Effect of Microstructure on High-Temperature Mechanical Behavior of Nickel-Base Superalloys for Turbine Disc Applications

2007-07-03 , Sharpe, Heather Joan

Engineers constantly seek advancements in the performance of aircraft and power generation engines, including, lower costs and emissions, and improved fuel efficiency. Nickel-base superalloys are the material of choice for turbine discs, which experience some of the highest temperatures and stresses in the engine. Engine performance is proportional to operating temperatures. Consequently, the high-temperature capabilities of disc materials limit the performance of gas-turbine engines. Therefore, any improvements to engine performance necessitate improved alloy performance. In order to take advantage of improvements in high-temperature capabilities through tailoring of alloy microstructure, the overall objectives of this work were to establish relationships between alloy processing and microstructure, and between microstructure and mechanical properties. In addition, the project aimed to demonstrate the applicability of neural network modeling to the field of Ni-base disc alloy development and behavior. A full program of heat-treatment, microstructural quantification, mechanical testing, and neural network modeling was successfully applied to next generation Ni-base disc alloys. Mechanical testing included hot tensile, hot hardness, creep deformation, creep crack growth, and fatigue crack growth. From this work the mechanisms of processing-structure and structure-property relationships were studied. Further, testing results were used to demonstrate the applicability of machine-learning techniques to the development and optimization of this family of superalloys.

View
Thumbnail Image
Item

Physically-based models for elevated temperature low cycle fatigue crack initiation and growth in Rene 88DT

2005-05-05 , Findley, Kip Owen

The aircraft engine industry is constantly striving to increase the operating temperature and stresses in hot section engine components, a goal that can only be achieved by accurately modeling and predicting damage mechanisms of potential engine materials. The objective of this work is to develop physically-based models that are able to accurately predict the high temperature crack initiation behavior of Rene 88DT, a commonly used aircraft engine disk material, under low cycle fatigue (LCF) conditions. Two different microstructural conditions were produced by subjecting the material to two separate heat treatments; the heat treatments were selected so that grain size remains the same but the size distribution of the strengthening gamma prime precipitate is different between the two conditions. LCF experiments were performed on specimens from each condition at 650C and R = -1 under strain ranges of 0.66%, 0.75%, and 1.5%. A third microstructural condition with a similar grain size but different gamma prime size distribution was tested by another source at 650C and R = 0 under strain ranges of 0.66%, 0.79%, 0.94%, and 1.14%. The results indicate that there are two competing crack initiation mechanisms: initiation from a microstructural defect such as an inclusion and initiation from slip band cracking. A physically based model, in the form of a modified Fatemie-Socie parameter, is utilized to predict the crack initiation mechanism and approximate cycles to failure based on the microstructure of the material and applied strain. Long crack growth models are also developed to model crack growth from subsurface inclusions and surface semi-elliptical cracks. These models predict that long crack growth is a small portion of the total fatigue life in these conditions, which suggests that the majority of the fatigue life is spent initiating a dominant fatigue crack.

View
Thumbnail Image
Item

Creep behavior of aluminum alloys C415-T8 and 2519-T87

1997-08 , Hamilton, Benjamin Carter

View
Thumbnail Image
Item

Characterization of Nanostructured Metals and Metal Nanowires for Ultra-High Density Chip-to-Package Interconnections

2006-12-01 , Bansal, Shubhra

Nanocrystalline materials are being explored as potential off-chip interconnects materials for next generation microelectronics packaging. Mechanical behavior and deformation mechanisms in nanocrystalline copper and nickel have been explored. Nanostructured copper interconnections exhibit better fatigue life as compared to microcrystalline copper interconnects at a pitch of 100 and #956;m and lower. Nanocrystalline copper is quite stable upto 100 oC whereas nickel is stable even up to 400 oC. Grain boundary (GB) diffusion along with grain rotation and coalescence has been identified as the grain growth mechanism. Ultimate tensile and yield strength of nanocrystalline (nc) Cu and Ni are atleast 5 times higher than microcrystalline counterparts. Considerable amount of plastic deformation has been observed and the fracture is ductile in nature. Fracture surfaces show dimples much larger than grain size and stretching between dimples indicates localized plastic deformation. Activation energies for creep are close to GB diffusion activation energies indicating GB diffusion creep. Creep rupture at 45o to the loading axis and fracture surface shows lot of voiding and ductile kind of fracture. Grain rotation and coalescence along direction of maximum resolved shear stress plays an important role during creep. Grain refinement enhances the endurance limit and hence high cycle fatigue life. However, a deteriorating effect of grain refinement has been observed on low cycle fatigue life. This is because of the ease of crack initiation in nanomaterials. Persistent slip bands (PSBs) at an angle of 45o to loading axis are observed at higher strain ranges (> 1% for nc- Cu) with a width of about 50 nm. No relationship has been observed between PSBs and crack initiation. A non-recrystallization annealing treatment, 100 oC/ 2 hrs for nc- Cu and 250 oC/ 2 hrs for nc- Ni has been shown to improve the LCF life without lowering the strength much. Fatigue crack growth resistance is higher in nc- Cu and Ni compared to their microcrystalline counterparts. This is due to crack deflection at GBs leading to a tortuous crack path. Nanomaterials exhibit higher threshold stress intensity factors and effective threshold stress intensity is proportional to the elastic modulus of the material.

View
Thumbnail Image
Item

Modeling creep behavior in a directionally solidified nickel base superalloy

2003-12-01 , Ibanez, Alejandro R.

View
Thumbnail Image
Item

Creep-fatigue crack growth in Cr-Mo-V base material and weldments

1996-05 , Grover, Parmeet S.

View