Title:
New concept for low cost, high throughput inspection for cracks in PV manufacturing
New concept for low cost, high throughput inspection for cracks in PV manufacturing
Author(s)
Danyluk, Steven
Yang, Yeyuan (Chris)
Yang, Yeyuan (Chris)
Advisor(s)
Editor(s)
Collections
Supplementary to
Permanent Link
Abstract
The research objectives of this project were to validate a new concept in surface inspection of thin crystalline silicon wafers of the type used in photovoltaic manufacturing with electrostatic imaging technique (Kelvin probes) to reveal surface cracks.
Sponsor
National Science Foundation (U.S.)
Date Issued
2012-06
Extent
Resource Type
Text
Resource Subtype
Technical Report