Title:
Quantification of ultrasonic shear wave scattering from an element of a compound scatterer in a bonded plate via wavefield imaging

Thumbnail Image
Author(s)
Maki, Carson
Authors
Advisor(s)
Jacobs, Laurence J.
Michaels, Jennifer E.
Advisor(s)
Editor(s)
Associated Organization(s)
Series
Supplementary to
Abstract
This work addresses ultrasonic shear wave scattering from buried defects emanating from through-holes in bonded metallic specimens. Methods are developed for segregating, analyzing, and quantifying scattering from a single element of a compound scatterer via ultrasonic wavefield imaging. Wavefield baseline subtraction is applied for this type of segregation; however, it is shown to fail if a suitable baseline is not available. Research tasks include specimen design and fabrication, measurement technique and data quality improvement, and development of various analysis methods using such techniques as frequency-wavenumber filtering, temporal and spatial windowing, and direct image analysis.
Sponsor
Date Issued
2017-05-17
Extent
Resource Type
Text
Resource Subtype
Thesis
Rights Statement
Rights URI