Title:
Integrating Three-dimensional High Capacitance Density Structures

Thumbnail Image
Author(s)
Authors
Advisor(s)
Advisor(s)
Editor(s)
Associated Organization(s)
Organizational Unit
Series
Supplementary to
Abstract
Disclosed are three-dimensional dielectric structures on high surface area electrodes and fabrication methods. Exemplary structures comprise a copper foil substrate, trench electrodes or high surface area porous electrode structures formed on the substrate, a insulating thin film formed on the surface and laminating the foil on a organic substrate. A variety of materials may be used to make the films including perovksite ceramics such as barium titanate, strontium titanate, barium strontium titanate (BST), lead zirconate titanate (PZT); other intermediate dielectric constant films such as zinc oxide, aluminum nitride, silicon nitride; typical paraelectrics such as tantalum oxide, alumina, and titania. The films may be fabricated using sol-gel, hydrothermal synthesis, anodization or vapor deposition techniques.
Sponsor
Date Issued
5/8/2012
Extent
Resource Type
Text
Resource Subtype
Patent
Rights Statement
Rights URI