Title:
Integrated Passive Devices Fabricated Utilizing Multi-layer, Organic Laminates
Integrated Passive Devices Fabricated Utilizing Multi-layer, Organic Laminates
Files
Authors
Authors
Advisors
Advisors
Associated Organizations
Organizational Unit
Series
Series
Collections
Supplementary to
Permanent Link
Abstract
The present invention includes an organic device that can be integrated in a multilayer board made of organic material. The passive devices can be integrally fabricated on a circuit board in either surface mount device (SMD) or ball grid array (BGA) form. Alternatively, the passive device can be constructed in a stand alone SMD or BGA/chip scale package (CSP) form to make it mountable on a multilayer board, ceramic carrier or silicon platform in the form of an integrated passive device. The passive device includes side shielding on two sides in the SMD form and four sides in the BGA/CSP form. The side shielding can be external or in-built.
Sponsor
Date Issued
6/27/2006
Extent
Resource Type
Text
Resource Subtype
Patent