Title:
Backplane, Printed Wiring Board, And/or Multi-chip Module-level Optical Interconnect Layer Having Embedded Air-gap Technologies And Methods Of Fabrication
Backplane, Printed Wiring Board, And/or Multi-chip Module-level Optical Interconnect Layer Having Embedded Air-gap Technologies And Methods Of Fabrication
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Abstract
Optical interconnect layers and methods of fabrication thereof are described. In addition, the optical interconnect layers integrated into devices such as backplane (BP), printed wiring board (PWB), and multi-chip module (MCM) level devices are described. A representative optical interconnect layer includes a first cladding layer, a second cladding layer, one or more waveguides having a waveguide core and an air-gap cladding layer engaging a portion of waveguide core, wherein the first cladding layer and the second cladding layer engage the waveguide.
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Date Issued
9/7/2004
Extent
Resource Type
Text
Resource Subtype
Patent