Title:
Object Inspection Method And System

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Abstract
The present disclosure relates to an object inspection system. The object inspection system comprises an ultrasound source capable of exciting the object to be tested with a stimulus such that the object vibrates at an ultrasound frequency, at least one optical fiber optically connected to the ultrasound source and adapted to be positioned with its exit end in close proximity to a surface of the object to be tested to deliver the stimulus to the object, a vibration sensing device adapted to sense the ultrasonic vibration displacements created in the object by the ultrasound source, and a system controller which receives the ultrasonic vibration data from the vibration sensing device. In a preferred arrangement, the object inspection system comprises a solder joint inspection system for testing the integrity of solder joints used to connect a computer chip to a printed circuit board.
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Date Issued
6/8/2004
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Patent
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