Title:
Processes And Apparatus For Lift-off And Bonding Of Materials And Devices

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Abstract
Novel processes and apparatus permit lift-off, alignment, and bonding of materials and devices. The processes involve first depositing a device layer on a sacrifical layer situated on a growth substrate. A device may be defined in the device layer. The device layer or the device is coated with a carrier layer. The sacrificial layer and/or the growth substrate are then etched away to release the combination of the device layer and the carrier layer from the growth substrate. The device layer or device can then be aligned and selectively bonded to a host substrate. Other processes and apparatus are set forth for facilitating lift-off, bonding, handling, and patterning of he device layer or device.
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11/7/1995
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