Title:
Transient Polymers for Low-k Dielectrics and Decomposing Electronic Devices
Transient Polymers for Low-k Dielectrics and Decomposing Electronic Devices
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Author(s)
Kohl, Paul A.
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Abstract
Dielectric materials (i.e. insulators) provide critical functions throughout the packaging hierarchy, including on-chip dielectrics, package substrates, and printed wiring boards. Transient polymers, those which vaporize on command, can be used to form ultra low-k dielectrics, such as porous materials or air-cavities. Transient polymers can also be used as coatings or structural materials in electronic packages and devices enabling the disappearance of the device when the collection, recovery or disposal of the device is difficult.
In this presentation, the nature of transient polymers will be described including their synthesis, and physical properties. Transient polymers can be decomposed to the liquid or gaseous state when exposed to thermal, chemical or photo-chemical stimulus. The response time and type of stimulus will be described. Finally, several applications for transient polymers in the fabrication of unique devices, structures or packages will be described.
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Date Issued
2016-09-16
Extent
59.09 minutes
Resource Type
Moving Image
Resource Subtype
Lecture