Title:
Study on the curing process of no-flow and wafer level underfill for flip-chip applications
Study on the curing process of no-flow and wafer level underfill for flip-chip applications
Author(s)
Zhang, Zhuqing
Advisor(s)
Wong, C. P.
Editor(s)
Collections
Supplementary to
Permanent Link
Abstract
Sponsor
Date Issued
2003-12-01
Extent
42711304 bytes
Resource Type
Text
Resource Subtype
Dissertation