Title:
Application of internal state variable models to thermal processing and reliability of plated through holes in printed wiring boards
Application of internal state variable models to thermal processing and reliability of plated through holes in printed wiring boards
Authors
Fu, Chia-Yu
Authors
Advisors
Ume, I. Charles
Advisors
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Abstract
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Date Issued
1999-08
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Text
Resource Subtype
Dissertation
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Access restricted to authorized Georgia Tech users only.