Title:
Design and development of stress-engineered compliant interconnect in microelectronic packaging
Design and development of stress-engineered compliant interconnect in microelectronic packaging
Author(s)
Ma, Lunyu
Advisor(s)
Sitaraman, Suresh K.
Editor(s)
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Abstract
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Date Issued
2003-08
Extent
Resource Type
Text
Resource Subtype
Dissertation
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Access restricted to authorized Georgia Tech users only.