Title:
System implementation, modeling and defects pattern recognition for flip chip solder joint inspection using laser techniques
System implementation, modeling and defects pattern recognition for flip chip solder joint inspection using laser techniques
Authors
Liu, Sheng
Authors
Advisors
Ume, I. Charles
Advisors
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Organizational Unit
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Abstract
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Date Issued
2001-05
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Resource Type
Text
Resource Subtype
Dissertation
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Access restricted to authorized Georgia Tech users only.