Title:
Conductivity Mechanisms of Isotropic Conductive Adhesives (ICA’s)
Conductivity Mechanisms of Isotropic Conductive Adhesives (ICA’s)
Authors
Wong, C. P.
Lu, Daoqiang
Tong, Quinn K.
Lu, Daoqiang
Tong, Quinn K.
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Abstract
Isotropic conductive adhesives (ICA’s) are usually
composites of adhesive resins with conductive fillers (mainly
silver flakes). The adhesive pastes before cure usually have low
electrical conductivity. The conductive adhesives become highly
conductive only after the adhesives are cured and solidified. The
mechanisms of conductivity achievement in conductive adhesives
were discussed. Experiments were carefully designed in order to
determine the roles of adhesive shrinkage and silver (Ag) flake
lubricant removal on adhesive conductivity achievement during
cure. The conductivity establishment of the selected adhesive
pastes and the cure shrinkage of the corresponding adhesive
resins during cure were studied. Then conductivity developments
of some metallic fillers and ICA pastes with external pressures
were studied by using a specially designed test device. In addition,
conductivity, resin cure shrinkage, and Ag flake lubricant
behavior of an ICA which was cured at room temperature
(25 ℃) were investigated. Based on the results, it was found
that cure shrinkage of the resin, rather than lubricant removal,
was the prerequisite for conductivity development of conductive
adhesives. In addition, an explanation of how cure shrinkage
could cause conductivity achievement of conductive adhesives
during cure was proposed in this paper.
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Date Issued
1999-07
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