Title:
High Performance No-Flow Underfills for Low-Cost Flip-Chip Applications: Material Characterization
High Performance No-Flow Underfills for Low-Cost Flip-Chip Applications: Material Characterization
Author(s)
Wong, C. P.
Shi, Songhua
Jefferson, G.
Shi, Songhua
Jefferson, G.
Advisor(s)
Editor(s)
Collections
Supplementary to
Permanent Link
Abstract
Underfill encapsulant is critical to the reliability of the flip-chip solder joint interconnects. Novel no-flow underfill
encapsulant is an attractive flip-chip encapsulant due to the simplification of the no-flow underfilling process. To develop the no-flow underfill material suitable for the no-flow underfilling
process of flip-chip solder joint interconnects, we have studied
and developed a series of metal chelate latent catalysts for the no-flow underfill formulation. The latent catalyst has minimal
reaction with the epoxy resin cycloaliphatic type epoxy) and the
crosslinker (or hardener) at the low temperature (< 180 ℃) prior
to the solder reflow and then rapid reaction takes place to form
the low-cost high performance underfills. The effects of the concentration
of the hardener and catalyst on the curing profile and
physical properties of the cured formulations were studied. The
kinetics and exothermic heat of the curing reactions of these formulations
were investigated by differential scanning calorimetry
(DSC). Glass transition temperature (T[subscript g]) and thermal coefficient
of expansion (TCE) of these cured resins were investigated by
thermo-mechanical analyzer (TMA). Storage moduli (E′; E″)
and crosslinking density of the cured formulations were measured
by dynamic-mechanical analyzer (DMA).Weight loss of these formulations
during curing was investigated by thermo-gravimetric
analyzer (TGA). Additionally, some comparison results of our
successful novel generic underfills with the current commercial
experimental no-flow underfills are reported.
Sponsor
Date Issued
1998-09
Extent
228069 bytes
Resource Type
Text
Resource Subtype
Article