Title:
An Improved Methodology for Determining Temperature Dependent Moduli of Underfill Encapsulants
An Improved Methodology for Determining Temperature Dependent Moduli of Underfill Encapsulants
Authors
Wong, C. P.
Rao, Yang
Shi, Songhua
Rao, Yang
Shi, Songhua
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Abstract
Finite element analyses (FEAs) have been widely
used to preventively predict the reliability issues of flip-chip (FC)
packages. The validity of the simulation results strongly depends
on the inputs of the involved material properties. For FC packages
Young’s modulus-temperature relationship is a critical material
property in predicting of the package reliability during 55°C
to 125°C thermal cycling. Traditional tensile tests can obtain the
modulus at selected temperatures, but it is tedious, expensive, and
unable to accurately predict the Young’s modulus-temperature
relationship within a wide temperature range. Thus, this paper
is targeted to provide a simple but relatively accurate methodology
to obtain the Young’s modulus-temperature relationship.
In this paper, three commercial silica filled underfill materials
were studied. A simple specimen (based on ASTM D638M)
preparation method was established using a Teflon mold. A
dynamic-mechanical analyzer (DMA) was used to obtain the
stress-strain relationship under controlled force mode, storage
and loss modulus under multi-frequency mode, and stress relaxation
under stress relaxation mode. A simple viscoelastic model
was used and an empirical methodology for obtaining Young’s
modulus-temperature relationship was established.
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Date Issued
2000-09
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171983 bytes
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