Title:
An Improvement of Thermal Conductivity of Underfill Materials for Flip-Chip Packages
An Improvement of Thermal Conductivity of Underfill Materials for Flip-Chip Packages
Authors
Wong, C. P.
Li, Haiying
Jacob, Karl I.
Li, Haiying
Jacob, Karl I.
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Abstract
Effective heat dissipation is crucial to enhance the
performance and reliability of electronic devices. In this work, the
performance of encapsulants filled with carbon fiber was studied
and compared with silica filled encapsulants. Encapsulants filled
with mixed combination of fillers for optimizing key properties
were also investigated. The thermal and electrical conductivities
were investigated and glass transition temperature (Tg), thermal
expansion coefficient (TCE), and storage modulus ( ) of these
materials were studied with thermal analysis methods. The composites
filled with both carbon fiber and silica showed an increase
of thermal conductivity three to five times of that of silica filled encapsulants
of the same filler loading while maintaining/enhancing
major mechanical and thermal properties.
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Date Issued
2003-02
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