Title:
An Improved Methodology for Determining Temperature Dependent Moduli of Underfill Encapsulants

dc.contributor.author Wong, C. P.
dc.contributor.author Rao, Yang
dc.contributor.author Shi, Songhua
dc.date.accessioned 2006-08-15T18:54:00Z
dc.date.available 2006-08-15T18:54:00Z
dc.date.issued 2000-09
dc.description ©2000 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or distribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. en
dc.description.abstract Finite element analyses (FEAs) have been widely used to preventively predict the reliability issues of flip-chip (FC) packages. The validity of the simulation results strongly depends on the inputs of the involved material properties. For FC packages Young’s modulus-temperature relationship is a critical material property in predicting of the package reliability during 55°C to 125°C thermal cycling. Traditional tensile tests can obtain the modulus at selected temperatures, but it is tedious, expensive, and unable to accurately predict the Young’s modulus-temperature relationship within a wide temperature range. Thus, this paper is targeted to provide a simple but relatively accurate methodology to obtain the Young’s modulus-temperature relationship. In this paper, three commercial silica filled underfill materials were studied. A simple specimen (based on ASTM D638M) preparation method was established using a Teflon mold. A dynamic-mechanical analyzer (DMA) was used to obtain the stress-strain relationship under controlled force mode, storage and loss modulus under multi-frequency mode, and stress relaxation under stress relaxation mode. A simple viscoelastic model was used and an empirical methodology for obtaining Young’s modulus-temperature relationship was established. en
dc.format.extent 171983 bytes
dc.format.mimetype application/pdf
dc.identifier.citation IEEE Transactions on Components and Packaging Technologies, Vol. 23, no. 3, September 2000, 434-439 en
dc.identifier.uri http://hdl.handle.net/1853/11419
dc.language.iso en_US en
dc.publisher Georgia Institute of Technology en
dc.publisher.original Institute of Electrical and Electronics Engineers, Inc., New York
dc.subject Encapsulant en
dc.subject Loss modulus en
dc.subject Modulus-temperature relationship en
dc.subject Storage modulus en
dc.subject Stress-strain relationship en
dc.subject Underfill en
dc.subject Viscoelastic model en
dc.subject Young's modulus en
dc.title An Improved Methodology for Determining Temperature Dependent Moduli of Underfill Encapsulants en
dc.type Text
dc.type.genre Article
dspace.entity.type Publication
local.contributor.author Wong, C. P.
local.contributor.corporatename School of Materials Science and Engineering
local.contributor.corporatename College of Engineering
relation.isAuthorOfPublication 76540daf-1e96-4626-9ec1-bc8ed1f88e0a
relation.isOrgUnitOfPublication 21b5a45b-0b8a-4b69-a36b-6556f8426a35
relation.isOrgUnitOfPublication 7c022d60-21d5-497c-b552-95e489a06569
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