Title:
An Improved Methodology for Determining Temperature Dependent Moduli of Underfill Encapsulants
An Improved Methodology for Determining Temperature Dependent Moduli of Underfill Encapsulants
dc.contributor.author | Wong, C. P. | |
dc.contributor.author | Rao, Yang | |
dc.contributor.author | Shi, Songhua | |
dc.date.accessioned | 2006-08-15T18:54:00Z | |
dc.date.available | 2006-08-15T18:54:00Z | |
dc.date.issued | 2000-09 | |
dc.description | ©2000 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or distribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. | en |
dc.description.abstract | Finite element analyses (FEAs) have been widely used to preventively predict the reliability issues of flip-chip (FC) packages. The validity of the simulation results strongly depends on the inputs of the involved material properties. For FC packages Young’s modulus-temperature relationship is a critical material property in predicting of the package reliability during 55°C to 125°C thermal cycling. Traditional tensile tests can obtain the modulus at selected temperatures, but it is tedious, expensive, and unable to accurately predict the Young’s modulus-temperature relationship within a wide temperature range. Thus, this paper is targeted to provide a simple but relatively accurate methodology to obtain the Young’s modulus-temperature relationship. In this paper, three commercial silica filled underfill materials were studied. A simple specimen (based on ASTM D638M) preparation method was established using a Teflon mold. A dynamic-mechanical analyzer (DMA) was used to obtain the stress-strain relationship under controlled force mode, storage and loss modulus under multi-frequency mode, and stress relaxation under stress relaxation mode. A simple viscoelastic model was used and an empirical methodology for obtaining Young’s modulus-temperature relationship was established. | en |
dc.format.extent | 171983 bytes | |
dc.format.mimetype | application/pdf | |
dc.identifier.citation | IEEE Transactions on Components and Packaging Technologies, Vol. 23, no. 3, September 2000, 434-439 | en |
dc.identifier.uri | http://hdl.handle.net/1853/11419 | |
dc.language.iso | en_US | en |
dc.publisher | Georgia Institute of Technology | en |
dc.publisher.original | Institute of Electrical and Electronics Engineers, Inc., New York | |
dc.subject | Encapsulant | en |
dc.subject | Loss modulus | en |
dc.subject | Modulus-temperature relationship | en |
dc.subject | Storage modulus | en |
dc.subject | Stress-strain relationship | en |
dc.subject | Underfill | en |
dc.subject | Viscoelastic model | en |
dc.subject | Young's modulus | en |
dc.title | An Improved Methodology for Determining Temperature Dependent Moduli of Underfill Encapsulants | en |
dc.type | Text | |
dc.type.genre | Article | |
dspace.entity.type | Publication | |
local.contributor.author | Wong, C. P. | |
local.contributor.corporatename | School of Materials Science and Engineering | |
local.contributor.corporatename | College of Engineering | |
relation.isAuthorOfPublication | 76540daf-1e96-4626-9ec1-bc8ed1f88e0a | |
relation.isOrgUnitOfPublication | 21b5a45b-0b8a-4b69-a36b-6556f8426a35 | |
relation.isOrgUnitOfPublication | 7c022d60-21d5-497c-b552-95e489a06569 |