Title:
Devices Having Compliant Wafer-level Input/output Interconnections And Packages Using Pillars And Methods Of Fabrication Thereof

dc.contributor.patentcreator Bakir, Muhannad S.
dc.contributor.patentcreator Meindl, James D.
dc.date.accessioned 2017-05-12T14:28:16Z
dc.date.available 2017-05-12T14:28:16Z
dc.date.filed 5/5/2003
dc.date.issued 11/14/2006
dc.description.abstract Devices having one or more of the following: an input/output (I/O) interconnect system, an optical I/O interconnect, an electrical I/O interconnect, a radio frequency I/O interconnect, are disclosed. A representative I/O interconnect system includes a first substrate and a second substrate. The first substrate includes a compliant pillar vertically extending from the first substrate. The compliant pillar is constructed a first material. The second substrate includes a compliant socket adapted to receive the compliant pillar. The compliant socket is constructed of a second material.
dc.description.assignee Georgia Tech Research Corporation
dc.identifier.cpc G01R1/0491
dc.identifier.cpc G01R31/2863
dc.identifier.cpc G02B6/12002
dc.identifier.patentapplicationnumber 10/430670
dc.identifier.patentnumber 7135777
dc.identifier.uri http://hdl.handle.net/1853/57658
dc.identifier.uspc 257/773
dc.title Devices Having Compliant Wafer-level Input/output Interconnections And Packages Using Pillars And Methods Of Fabrication Thereof
dc.type Text
dc.type.genre Patent
dspace.entity.type Publication
local.contributor.corporatename Georgia Institute of Technology
local.relation.ispartofseries Georgia Tech Patents
relation.isOrgUnitOfPublication cc30e153-7a64-4ae2-9b1d-5436686785e3
relation.isSeriesOfPublication 0f49c79d-4efb-4bd9-b060-5c7f9191b9da
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