Modeling, design, fabrication and characterization of miniaturized passives and integrated EM shields in 3D RF packages

Sitaraman, Srikrishna

Title:

Modeling, design, fabrication and characterization of miniaturized passives and integrated EM shields in 3D RF packages

dc.contributor.advisor	Peterson, Andrew F.
dc.contributor.author	Sitaraman, Srikrishna
dc.contributor.committeeMember	Papapolymerou, John
dc.contributor.committeeMember	Hesketh, Peter
dc.contributor.committeeMember	Raj, Pulugurtha Markondeya
dc.contributor.committeeMember	Tummala, Rao R.
dc.contributor.department	Electrical and Computer Engineering
dc.date.accessioned	2016-01-07T17:24:42Z
dc.date.available	2016-01-07T17:24:42Z
dc.date.created	2015-12
dc.date.issued	2015-08-25
dc.date.submitted	December 2015
dc.date.updated	2016-01-07T17:24:42Z
dc.description.abstract	An innovative structure for thin-film band-pass filters was proposed and analyzed. This structure was employed in the design, fabrication, and development of 3D IPD diplexers on glass substrates with double-side metallization electrically connected by through-vias. Through modeling, design, fabrication and characterization of the WLAN 3D IPD glass diplexers, the proposed filter structure was shown to enable miniaturized and high-performance RF passives. Further, component-level shield structures were developed to provide electromagnetic interference isolation between thin-film passives that are placed less than 100 µm apart. Glass substrates were designed, fabricated and characterized to demonstrate the shield effectiveness of metallized trench and via-array-based shields. The integration of such shields in miniaturized WLAN RF modules enables up to 60dB EM isolation in the frequency range of 1- 20GHz. Advanced RF module technologies based on 3D IPAC concept were designed and demonstrated with ultra-thin low-loss organic and glass substrates, integrating the proposed WLAN actives with miniaturized diplexer and EM shields. Double-side integration of such high-performance components on ultra-thin glass substrates enables up to 8x volume miniaturization including more than 3x reduction in area. Thus, the advanced components demonstrated in this research, vis-a-vis miniaturized diplexers and component-level EMI shields; integrated with actives in ultra-thin glass substrates using the 3D IPAC concept, can enable highly-miniaturized smart systems with multiband wireless communication capabilities.
dc.description.degree	Ph.D.
dc.format.mimetype	application/pdf
dc.identifier.uri	http://hdl.handle.net/1853/54369
dc.language.iso	en_US
dc.publisher	Georgia Institute of Technology
dc.subject	RF modules
dc.subject	WLAN
dc.subject	Packaging
dc.subject	EMI
dc.subject	Diplexer
dc.subject	3D IPD
dc.subject	SOP
dc.title	Modeling, design, fabrication and characterization of miniaturized passives and integrated EM shields in 3D RF packages
dc.type	Text
dc.type.genre	Dissertation
dspace.entity.type	Publication
local.contributor.advisor	Peterson, Andrew F.
local.contributor.corporatename	School of Electrical and Computer Engineering
local.contributor.corporatename	College of Engineering
relation.isAdvisorOfPublication	080ab541-0779-41ab-ae29-90761a9f6649
relation.isOrgUnitOfPublication	5b7adef2-447c-4270-b9fc-846bd76f80f2
relation.isOrgUnitOfPublication	7c022d60-21d5-497c-b552-95e489a06569
thesis.degree.level	Doctoral