Title:
Modeling, design, fabrication and characterization of miniaturized passives and integrated EM shields in 3D RF packages
Modeling, design, fabrication and characterization of miniaturized passives and integrated EM shields in 3D RF packages
Author(s)
Sitaraman, Srikrishna
Advisor(s)
Peterson, Andrew F.
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Abstract
An innovative structure for thin-film band-pass filters was proposed and analyzed. This structure was employed in the design, fabrication, and development of 3D IPD diplexers on glass substrates with double-side metallization electrically connected by through-vias. Through modeling, design, fabrication and characterization of the WLAN 3D IPD glass diplexers, the proposed filter structure was shown to enable miniaturized and high-performance RF passives. Further, component-level shield structures were developed to provide electromagnetic interference isolation between thin-film passives that are placed less than 100 µm apart. Glass substrates were designed, fabricated and characterized to demonstrate the shield effectiveness of metallized trench and via-array-based shields. The integration of such shields in miniaturized WLAN RF modules enables up to 60dB EM isolation in the frequency range of 1- 20GHz. Advanced RF module technologies based on 3D IPAC concept were designed and demonstrated with ultra-thin low-loss organic and glass substrates, integrating the proposed WLAN actives with miniaturized diplexer and EM shields. Double-side integration of such high-performance components on ultra-thin glass substrates enables up to 8x volume miniaturization including more than 3x reduction in area. Thus, the advanced components demonstrated in this research, vis-a-vis miniaturized diplexers and component-level EMI shields; integrated with actives in ultra-thin glass substrates using the 3D IPAC concept, can enable highly-miniaturized smart systems with multiband wireless communication capabilities.
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Date Issued
2015-08-25
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Resource Type
Text
Resource Subtype
Dissertation