Title:
Compliant Wafer-level Packaging Devices And Methods Of Fabrication
Compliant Wafer-level Packaging Devices And Methods Of Fabrication
dc.contributor.patentcreator | Bakir, Muhannad S. | |
dc.contributor.patentcreator | Reed, Hollie | |
dc.contributor.patentcreator | Kohl, Paul | |
dc.contributor.patentcreator | Patel, Chirag S. | |
dc.contributor.patentcreator | Martin, Kevin P. | |
dc.contributor.patentcreator | Meindl, James | |
dc.date.accessioned | 2017-05-12T14:27:56Z | |
dc.date.available | 2017-05-12T14:27:56Z | |
dc.date.filed | 11/19/2001 | |
dc.date.issued | 2/10/2004 | |
dc.description.abstract | Devices and method of fabrication thereof are disclosed. A representative device includes one or more lead packages. The lead packages include a substrate including a plurality of die pads, an overcoat polymer layer, a plurality of sacrificial polymer layers disposed between the substrate and the overcoat polymer layer, and a plurality of leads. Each lead is disposed upon the overcoat polymer layer having a first portion disposed upon a die pad. The sacrificial polymer layer can be removed to form one or more air-gaps. | |
dc.description.assignee | Georgia Tech Research Corporation | |
dc.identifier.cpc | H01L23/49811 | |
dc.identifier.cpc | H01L2924/12044 | |
dc.identifier.cpc | H01L2924/0002 | |
dc.identifier.patentapplicationnumber | 09/993100 | |
dc.identifier.patentnumber | 6690081 | |
dc.identifier.uri | http://hdl.handle.net/1853/57515 | |
dc.identifier.uspc | 257/522 | |
dc.title | Compliant Wafer-level Packaging Devices And Methods Of Fabrication | |
dc.type | Text | |
dc.type.genre | Patent | |
dspace.entity.type | Publication | |
local.contributor.corporatename | Georgia Institute of Technology | |
local.relation.ispartofseries | Georgia Tech Patents | |
relation.isOrgUnitOfPublication | cc30e153-7a64-4ae2-9b1d-5436686785e3 | |
relation.isSeriesOfPublication | 0f49c79d-4efb-4bd9-b060-5c7f9191b9da |
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