Compliant Wafer-level Packaging Devices And Methods Of Fabrication

dc.contributor.patentcreator Bakir, Muhannad S.
dc.contributor.patentcreator Reed, Hollie
dc.contributor.patentcreator Kohl, Paul
dc.contributor.patentcreator Patel, Chirag S.
dc.contributor.patentcreator Martin, Kevin P.
dc.contributor.patentcreator Meindl, James
dc.date.accessioned 2017-05-12T14:27:56Z
dc.date.available 2017-05-12T14:27:56Z
dc.date.filed 11/19/2001
dc.date.issued 2/10/2004
dc.description.abstract Devices and method of fabrication thereof are disclosed. A representative device includes one or more lead packages. The lead packages include a substrate including a plurality of die pads, an overcoat polymer layer, a plurality of sacrificial polymer layers disposed between the substrate and the overcoat polymer layer, and a plurality of leads. Each lead is disposed upon the overcoat polymer layer having a first portion disposed upon a die pad. The sacrificial polymer layer can be removed to form one or more air-gaps.
dc.description.assignee Georgia Tech Research Corporation
dc.identifier.cpc H01L23/49811
dc.identifier.cpc H01L2924/12044
dc.identifier.cpc H01L2924/0002
dc.identifier.patentapplicationnumber 09/993100
dc.identifier.patentnumber 6690081
dc.identifier.uri http://hdl.handle.net/1853/57515
dc.identifier.uspc 257/522
dc.title Compliant Wafer-level Packaging Devices And Methods Of Fabrication
dc.type Text
dc.type.genre Patent
dspace.entity.type Publication
local.contributor.corporatename Georgia Institute of Technology
local.relation.ispartofseries Georgia Tech Patents
relation.isOrgUnitOfPublication cc30e153-7a64-4ae2-9b1d-5436686785e3
relation.isSeriesOfPublication 0f49c79d-4efb-4bd9-b060-5c7f9191b9da
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