Quantification of ultrasonic shear wave scattering from an element of a compound scatterer in a bonded plate via wavefield imaging

Thumbnail Image
Files
MAKI-THESIS-2017.pdf (2.58 MB)
Author(s)
Maki, Carson
Advisor(s)
Michaels, Jennifer E.
Editor(s)
Associated Organization(s)
Organizational Unit
Organizational Unit
Series
Collections
Theses and Dissertations
Supplementary to:
Permanent Link
http://hdl.handle.net/1853/60124
Abstract
This work addresses ultrasonic shear wave scattering from buried defects emanating from through-holes in bonded metallic specimens. Methods are developed for segregating, analyzing, and quantifying scattering from a single element of a compound scatterer via ultrasonic wavefield imaging. Wavefield baseline subtraction is applied for this type of segregation; however, it is shown to fail if a suitable baseline is not available. Research tasks include specimen design and fabrication, measurement technique and data quality improvement, and development of various analysis methods using such techniques as frequency-wavenumber filtering, temporal and spatial windowing, and direct image analysis.
Sponsor
Date
2017-05-17
Extent
Resource Type
Text
Resource Subtype
Thesis
Rights Statement
Rights URI