Title:
Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronics Devices

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dc.contributor.advisor Joshi, Yogendra
dc.contributor.author Wei, Xiaojin en_US
dc.contributor.committeeMember Fedorov, Anei G.
dc.contributor.committeeMember Bruno Frazier
dc.contributor.committeeMember C.P. Wong
dc.contributor.committeeMember Hesketh, Peter J.
dc.contributor.department Mechanical Engineering en_US
dc.date.accessioned 2005-03-01T19:36:42Z
dc.date.available 2005-03-01T19:36:42Z
dc.date.issued 2004-11-30 en_US
dc.description.abstract A stacked microchannel heat sink was developed to provide efficient cooling for microelectronics devices at a relatively low pressure drop while maintaining chip temperature uniformity. Microfabrication techniques were employed to fabricate the stacked microchannel structure, and experiments were conducted to study its thermal performance. A total thermal resistance of less than 0.1 K/W was demonstrated for both counter flow and parallel flow configurations. The effects of flow direction and interlayer flow rate ratio were investigated. It was found that for the low flow rate range the parallel flow arrangement results in a better overall thermal performance than the counter flow arrangement; whereas, for the large flow rate range, the total thermal resistances for both the counter flow and parallel flow configurations are indistinguishable. On the other hand, the counter flow arrangement provides better temperature uniformity for the entire flow rate range tested. The effects of localized heating on the overall thermal performance were examined by selectively applying electrical power to the heaters. Numerical simulations were conducted to study the conjugate heat transfer inside the stacked microchannels. Negative heat flux conditions were found near the outlets of the microchannels for the counter flow arrangement. This is particularly evident for small flow rates. The numerical results clearly explain why the total thermal resistance for counter flow arrangement is larger than that for the parallel flow at low flow rates. In addition, laminar flow inside the microchannels were characterized using Micro-PIV techniques. Microchannels of different width were fabricated in silicon, the smallest channel measuring 34 mm in width. Measurements were conducted at various channel depths. Measured velocity profiles at these depths were found to be in reasonable agreement with laminar flow theory. Micro-PIV measurement found that the maximum velocity is shifted significantly towards the top of the microchannels due to the sidewall slope, a common issue faced with DRIE etching. Numerical simulations were conducted to investigate the effects of the sidewall slope on the flow and heat transfer. The results show that the effects of large sidewall slope on heat transfer are significant; whereas, the effects on pressure drop are not as pronounced. en_US
dc.description.degree Ph.D. en_US
dc.format.extent 2314346 bytes
dc.format.mimetype application/pdf
dc.identifier.uri http://hdl.handle.net/1853/4873
dc.language.iso en_US
dc.publisher Georgia Institute of Technology en_US
dc.subject Microchannels en_US
dc.subject Thermal management
dc.subject Electronic cooling
dc.subject Heat sink
dc.subject Liquid cooling
dc.subject Micro-PIV
dc.subject PIV
dc.subject Particle image velocimetry
dc.subject.lcsh Microelectronics Cooling en_US
dc.subject.lcsh Particle image velocimetry en_US
dc.subject.lcsh Heat sinks (Electronics) en_US
dc.subject.lcsh Heat Convection en_US
dc.subject.lcsh Liquids Thermal properties en_US
dc.title Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronics Devices en_US
dc.type Text
dc.type.genre Dissertation
dspace.entity.type Publication
local.contributor.advisor Joshi, Yogendra
local.contributor.corporatename George W. Woodruff School of Mechanical Engineering
local.contributor.corporatename College of Engineering
relation.isAdvisorOfPublication 63ef328b-076b-44b7-92a9-0f7dd03fa1fa
relation.isOrgUnitOfPublication c01ff908-c25f-439b-bf10-a074ed886bb7
relation.isOrgUnitOfPublication 7c022d60-21d5-497c-b552-95e489a06569
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