Plasma Etching at IEN: An Overview of Equipment and Processes

Chen, Hang

Title:

Plasma Etching at IEN: An Overview of Equipment and Processes

dc.contributor.author	Chen, Hang
dc.contributor.corporatename	Georgia Institute of Technology. Microelectronics Research Center	en_US
dc.contributor.corporatename	Georgia Institute of Technology. Nanotechnology Research Center	en_US
dc.contributor.corporatename	Georgia Institute of Technology. Institute for Electronics and Nanotechnology	en_US
dc.date.accessioned	2013-09-25T14:57:02Z
dc.date.available	2013-09-25T14:57:02Z
dc.date.issued	2013-09-10
dc.description	Hang Chen presented a lecture at the Nano@Tech Meeting on September 10, 2013 at 12 noon in room 1116 of the Marcus Nanotechnology Building.	en_US
dc.description	Dr. Hang Chen received his bachelor and master degrees in chemistry from Fudan University in Shanghai, China. He obtained his doctorate, also in chemistry, from Georgia Tech in 2005 and was a post-doc at the Nanotechnology Research Center before joining the IEN as a Research Scientist in 2008. His research interests include chemically sensitive field-effect transistors, MEMS-CMOS device integration, and organic electronics.
dc.description	Runtime: 62:35 minutes
dc.description.abstract	Plasma etching has become one of the most important techniques in IC fabrication. It plays a critical role in creating geometries of extremely small size for highly integrated devices. Plasma etching techniques utilize plasma created from appropriate gas mixtures and RF excitation to remove surface material physically or chemically (or both) from a substrate. Plasma etching can be categorized by the material as metal etching, silicon etching and dielectric etching, or it can be categorized by the technology as electron cyclotron resonance (ECR), reactive ion etching (RIE) or inductively coupled ion (ICP).	en_US
dc.embargo.terms	null	en_US
dc.format.extent	62:35 minutes
dc.identifier.uri	http://hdl.handle.net/1853/49133
dc.language.iso	en_US	en_US
dc.publisher	Georgia Institute of Technology	en_US
dc.relation.ispartofseries	Nano@Tech Lecture Series
dc.subject	Nanotechnology	en_US
dc.subject	Plasma etching	en_US
dc.title	Plasma Etching at IEN: An Overview of Equipment and Processes	en_US
dc.type	Moving Image
dc.type.genre	Lecture
dspace.entity.type	Publication
local.contributor.corporatename	Institute for Electronics and Nanotechnology (IEN)
local.relation.ispartofseries	Nano@Tech Lecture Series
relation.isOrgUnitOfPublication	5d316582-08fe-42e1-82e3-9f3b79dd6dae
relation.isSeriesOfPublication	accfbba8-246e-4389-8087-f838de8956cf