IInvestigation of Thermal Performance of Thin Films for Emerging Electronic Applications
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Vaca, Diego Esteban
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Abstract
The demands for faster and more robust wireless communication systems, superior power electronics, enhanced memory, advanced neuromorphic computation, and powerful portable electronics have accelerated the evolution of electronics. Regardless of the type of electronic system, critical components like transistors and diodes must be faster, smaller, and more efficient. These devices necessitate new materials, the thermal properties of which are critical in designing effective thermal management solutions. Moreover, these new materials' fabrication and integration methods significantly impact their thermal properties. Therefore, understanding the thermal properties of materials used in power electronics, memristors, and heat spreaders is paramount. This dissertation delves into this crucial topic, offering insights and research findings that stand to contribute to the field significantly.
In this dissertation, I present a comprehensive investigation into the thermal properties of various materials pertinent to emerging electronic devices. My research initially focused on the thermal conductivity of β-Ga2O3 thin films grown on different substrates. I utilized techniques such as Time-Domain Thermoreflectance (TDTR), Atomic Force Microscopy (AFM), and Transmission Electron Microscopy (TEM) to investigate this aspect. This detailed analysis enabled me to estimate the defect densities (vacancies and dislocations), offering insights into the impact of different defects on thermal conductivity.
Subsequently, I explored the thermal conductivity of various Ti-containing materials, specifically those used in memristor electrodes. I discovered that Ti2AlN (MAX Phase) could improve the performance of HfO2-based memristors compared to traditional TiN. My research also encompassed the evaluation of machine learning models in the context of thermal conductivity analysis. By comparing two Artificial Neural Network (ANN) architectures, I found that the task
was complex and would require further work to optimize model architecture and hyperparameters to have a model with enhanced predictive power.
Moreover, I examined the feasibility of hexagonal boron nitride (h-BN) and highly oriented pyrolytic graphite (HOPG) as heat spreaders for silicon chips in mobile devices. I performed simulations to compare the thermal performance of h-BN and HOPG. I studied various h-BN transfer methods to assess their adaptability to industrial processes. I concluded that HOPG outperforms h-BN not only in terms of thermal management but also in terms of costs and current commercial availability.
Lastly, I experimented with CYTOP and nanoporous copper (NP-Cu) for bonding HOPG heat spreaders on Si substrates. While it was evident that optimal bonding conditions still need to be determined, I concluded that both strategies to reduce thermal resistance—reducing the Bond Line Thickness (BLT) using CYTOP and improving the thermal conductivity of the bonding material with NP-Cu—shows promise.
This dissertation provides a pathway for the continued development of thermal management of emerging electronic materials, offering valuable insights and strategies that may guide future research and applications in this rapidly advancing field.
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Date
2023-09-07
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Dissertation