Title:
High fidelity control and simulation of a three degrees-of-freedom wafer handling robot
High fidelity control and simulation of a three degrees-of-freedom wafer handling robot
| dc.contributor.advisor | Lipkin, Harvey | |
| dc.contributor.author | Babayan, Elaina Noelle | |
| dc.contributor.committeeMember | Paredis, Chris | |
| dc.contributor.committeeMember | Mitchell, Robert | |
| dc.contributor.department | Mechanical Engineering | |
| dc.date.accessioned | 2016-01-07T17:22:19Z | |
| dc.date.available | 2016-01-07T17:22:19Z | |
| dc.date.created | 2014-12 | |
| dc.date.issued | 2014-12-05 | |
| dc.date.submitted | December 2014 | |
| dc.date.updated | 2016-01-07T17:22:19Z | |
| dc.description.abstract | Wafer handling robotics are critical in semiconductor manufacturing to enable tight control of temperature, humidity, and particle contamination during processing. Closed-loop dynamic modeling during the robot design process ensures designs meet throughput and stability specifications prior to prototype hardware purchase. Dynamic models are also used in model-based control to improve performance. This thesis describes the generation and mathematical verification of a dynamic model for a three degrees-of-freedom wafer handling mechanism with one linear and two rotary axes. The dynamic plant model is integrated with motion and motor controller models, and the closed-loop performance is compared with experimental data. Models with rigid and flexible connections are compared, and the flexible connection models are shown to overall agree better with a measured step response. The simulation time increase from the addition of flexible connections can be minimized by modeling only the component stiffnesses that impact the closed-loop mechanism response. A method for selecting which elements to include based on controller bandwidth is presented and shown to significantly improve simulation times with minimal impact on model predictive performance. | |
| dc.description.degree | M.S. | |
| dc.format.mimetype | application/pdf | |
| dc.identifier.uri | http://hdl.handle.net/1853/54313 | |
| dc.language.iso | en_US | |
| dc.publisher | Georgia Institute of Technology | |
| dc.subject | Lumped-parameter modeling | |
| dc.subject | Robotics | |
| dc.subject | Wafer handling | |
| dc.subject | Closed-loop simulation | |
| dc.title | High fidelity control and simulation of a three degrees-of-freedom wafer handling robot | |
| dc.type | Text | |
| dc.type.genre | Thesis | |
| dspace.entity.type | Publication | |
| local.contributor.corporatename | George W. Woodruff School of Mechanical Engineering | |
| local.contributor.corporatename | College of Engineering | |
| relation.isOrgUnitOfPublication | c01ff908-c25f-439b-bf10-a074ed886bb7 | |
| relation.isOrgUnitOfPublication | 7c022d60-21d5-497c-b552-95e489a06569 | |
| thesis.degree.level | Masters |